Product information
Sputtering ES-350SU
Overview
This structurally elaborated system accommodates diverse functions with ease of operation. This is used for thin film formations of electronic devices, for experiments of GMR, and for creating new materials of high temperature superconductors. The rotating function of target positioning is developed, enabling this system to sputter 5 targets by means of DC & RF power sources by using a single electrode. The substrate holder can be rotated and its speed can be selected.
Product specifications
1. Ultimate pressure 1.5 x 10-6Pa
2. Substrate size 2 inch in diameter
3. Heating temperature 600ºC
4. Heater type Lamp type heater
5. Target 3 inch x 5 pieces (motor-driven)
6. Vacuum pumps TMP 500L/sec and RP 250L/min
Load lock chamber
7. Ultimate pressure 6.6 x 10-5Pa
8. Vacuum pumps TMP60L/sec and RP90L/min
Options
9. Substrate holder with cooling function / Substrate holder with heating function
Cleaning function / UHV type / Radical beam source
