Product information
RIE ERI-2500
Overview
This is the etching system, which can make fine processing with high accuracy. Since this system employs a load lock chamber as standard, the etching chamber does not expose to the atmosphere, and high reproducibility and uniformity of fine processing (etching) by using chlorine gas can be achieved.
Product specifications
1. Ultimate pressure 5 x 10-6Pa
2. Chamber size 253mm (diameter) x 300mm (height)
3. Substrate size 2 inch in diameter
4. Substrate heating temp. 800ºC maximum by lamp type heater
5. Vacuum pumps TMP 210L/sec and RP 162L/min
Load lock chamber
6. Ultimate vacuum pressure 10-4Pa
7. Vacuum pumps TMP60L/sec and RP 90L/min
