Product information

This system is used for encapsulating (packaging) small electronic devices, display devices, etc. in a ultra-high vacuum environment and evaluating electrical characteristics. The unique heating method maintains an ultra-high vacuum even during heating process.

This system is equipped with probe mechanisms that can access any position, and is able to perform processing consistently in a ultra-high vacuum environment from encapsulation to electrical characteristics evaluation.

Specifications

■ Heating/Encapsulating chamber
1.Ultimate vacuum: 1.3 x 10-7Pa
2.Substrate package size: 50mm square
3.Substrate heating temperature: Max. 600oC
4.Evaluation probe: 3 pieces.
5.Voltage probe: 2 pieces
6.Pumping: Turbo molecular pump and rotary pump
■ Load lock chamber
1.Ultimate vacuum: 6.6 x 10-5Pa
2.Pumping: Turbo molecular pump and rotary pump